---------------------------- Forwarded with Changes --------------------------- From: dhickey::(DHICKY) at ~FABRIK Date: 11/1/96 4:32AM To: Andrew P Magee at Rogers-MCD *To: 27=technet::[log in to unmask]::25=SMTP at ~FABRIK Subject: Insulating layer ---------------------------------------------------------------------- --------- From the world of flex circuits......... We routinely encapsulate circuits using an adhesive covered polyimide coversheet. These materials can be punched or drilled to match any pattern of openings that you require and laminated to the board as a sheet or pieces. Typically the adhesive is 0.001" and the polyimide is 0.0005", 0.001", 0.002", 0.003" or 0.005". The polyimide provides >7000 V/mil and the adhesive gives >3500 V/mil dielectric strength. Our R/flex 2005 system is listed as UL94 V-0, 105C continuous operating temp., and also carries the Delta mark for use up to 120V and 15A. Andy Magee - Applications Engineer Rogers - Circuit Materials Tel: (602) 917-5237 Fax: (602) 917-5256 E-Mail: [log in to unmask] Website: http//www.rogers-corp.com/cmu //////////////////////////// // SERVICE TO THE LINE, // // ON THE LINE, // // ON TIME. // //////////////////////////// ______________________________ Forward Header __________________________________ Subject: Insulating layer Author: dhickey::(DHICKY) at ~FABRIK Date: 11/1/96 4:32 AM From: [log in to unmask] Date: Fri, Nov 1, 1996 4:32 AM Subject: Insulating layer To: Magee, Andrew P; technet Anyone, We have an application on a 2 layer board with through hole technology which requires an insulating material laminated/applied to one surface/side. Initially we thought of having a prepreg material laminated to one surface but are unsure if this is the most cost effective method. Anyone out there who knows of a method or material which would support this requirement please respond. Some of our requirements are; 1. Must be a UL recognized material 2. Must provide at least 500V of dielectric insulation 3. Would preferably be thin, .001-.003 thick. Some questions we have are; 1. What type of relief would be needed around PTH? 2. How thick would the material need to be? 3. Who is doing this type of fabrication today? 4. Can it be applied selectively? 5. What is the typical cost impact to a double sided board? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************