Hi TechNet! I have had the "opportunity" to be part of the committee working on the JSTD 001 document and the comment that "....Most of the requirements mentioned in the J-STD-001 are either cosmetic or not measurable by well-established inspection techniques" I take violent exception too! Yes, not all of the requirements in JSTD 001 have hard and fast data behind but just as many of the requirements do have data which the task group reviewed, argued over, and even retested. The JSTD 001 specification is being used by many companies to produce acceptable electronics hardware. No specification can prescribe requirements that fit every application for all electronics for all use environments. The JSTD 001 comes the closer to the goal of a "everyone can use" specification than any other document to date. Will it satisfy everyone's needs? No. All potential users should use the specification as it would apply to their product and use environments. As for Rensselear conducting data that could be used to improve JSTD 001 that would be wonderful - being part of the process instead of throwing stones at the specification is a positive, constructive activity. I suggest you talk to the task group chairman, Jerry Rosser, to get a better insight of the specification and how the testing you are planning could improve the specification. (Wow, sorry to get on my soapbox TechNet but that hit a nerve!) Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Validating J-STD-001B Author: [log in to unmask] at ccmgw1 Date: 10/30/96 8:15 PM Hi Technetters: We all know ANSI J-STD-001 provides the inspection guidelines for quality. What one never comes across is data correlating the numbers prescribed in the standard and quality/reliability issues. Most of the requirements mentioned in the J-STD-001 are either cosmetic or not measurable by well-established inspection techniques. Moreover, the implications of the standard on board, assembly, and process design is not clearly understood. I am posting this message to announce that we are initiating a research effort at Rensselaer that will focus on the above issue. In 1988 we had performed a study here at Rensselaer on this topic which revealed that (post-reflow) component tilt lowered the cycles to failure more than any other investigated variable. This has been published in several articles and books. At that time it was felt that the emerging standards would include some reliability and performance criteria. (which has not happened to date!) We now propose to back parts of the J-STD-001 with quantitative data as part of the 3rd phase of our Electronics Manufacturing Program. Other focal areas include Intelligent Manufacturing, Solder/joint characterization, Innovative soldering approaches, Alternatives to soldered interconnects, Recycling issues, and Online design and brokering. This program is an integrated effort with as much interaction between the focal areas as applicable. A kick-off meeting will be held on November 21st, 1996 at Rensselear Polytechnic Institute, Troy, NY to incorporate the opinions and suggestions of the attendees into the research program. Companies participating in the program will have direct access to the results and technical publications. Take a look at our web site http://www.cieem.rpi.edu for more information. You can also contact me for further details. Regards, Vijay Sankaran Research Associate Center for Integrated Electronics and Electronics Manufacturing Rensselaer Polytechnic Institute Troy, NY 12180 [log in to unmask] Phone: 518/276-2721 Fax: 518/276-2990 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************