I agree with Mr. Holton's TechNet message on OSPs.  How 
     about some information sharing on what they are all about.  
     What affect will OSPs have on No-clean soldering processes?  
     How about the affect on SMT processes?  Could OSPs be 
     something PCB suppliers could use to further "guarantee" 
     solderability when PCBs reach their customers?  What about 
     OSPs on components?  Just what are the pros and cons?  

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