---------------------------- Forwarded with Changes --------------------------- From: Andrew P Magee Date: 10/21/96 12:11PM To: Mary E. Kennedy Subject: Abstract ---------------------------------------------------------------------- --------- Our flex analysis software is now available for download at: http://www.rogers-corp.com/cmu ABSTRACT Flex circuits respond to physical forces in relatively predictable ways based on the materials used, the thickness of each layer, and the environmental conditions. The well-established "art" of flex circuit design and manufacture allows most flex applications to be successful without understanding the details of these interactions. As flex circuits are increasingly used for applications that push the technology envelope the old rules can sometimes be insufficient to insure success. With modern CAD/FEA software a complete analysis is possible, but this can be expensive and time consuming, and typically requires a great deal of skill to achieve accurate results. With some simplifying assumptions it's possible to sufficiently estimate the physical behavior of typical flex circuits by evaluating the relevant equations. To facilitate completing this analysis a desktop computer program implementing these equations is offered. The program allows for various constructions to be rapidly assessed and produces both numeric and graphical results for comparison. Equations for computing; the neutral axis, moment of inertia, deflection (bias) force, layer stress/strain, heat flow, thermal/hygroscopic stress/strain, and thermal/hygroscopic expansion are evaluated in this program. An additional program is included to aid in determining the coversheet adhesive thickness after lamination to an etched circuit pattern, based on adhesive volume. Andy Magee - Applications Engineer Rogers - Circuit Materials Tel: (602) 917-5237 Fax: (602) 917-5256 E-Mail: [log in to unmask] Website: http//www.rogers-corp.com/cmu //////////////////////////// // SERVICE TO THE LINE, // // ON THE LINE, // // ON TIME. // //////////////////////////// *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************