We are interested in DFA (Design for Assembly) software capable of evaluating packing efficiencies of subassemblies and hardware into final housings. Any inputs will be greatly appreciated. Jauwhei Hong @ usa.racal.com *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************