A review of J-STD-001A, par 7.1.7, and J-STD-001B(draft), par 7.1.5 indicate a change from the requirements of the cancelled Military specifications..ie... MIL-STD-2000, par 5.6.5.4, and 2000A, par 5.1.8. The requirement to reflow a PWA that has had leads cut after soldering appears to be eased. The cancelled specifications did not provide any latitude, but required all cut connections to be reflowed. The J-STDs allow the solder joints to either be reflowed or to be inspected for surface fractures at 10X. My understanding of the process is that reflow of a PWA is required when lead cutting is performed after soldering in order to eliminate any micro-fractures that may have occured due to the side loading effect of the lead trimming process. The micro-fractures that occur may not only be surface fractures but could be internal and therfore not detectable by surface 10X inspection. I would appreciate if you could provide me with any information regarding surface vs internal micro-fractures occuring during the trimming process. Angelo Scarcella DCMDE-OTDP 495 Summer St. Boston, MA 02210 tel. (617) 753-4892, FAX (617) 753-4250 e-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************