---------- From: leila To: wallyd Subject: RE: Solder defect rate at 20mil pitch (fwd) Date: Tuesday, January 09, 1996 10:12AM Mr. Doeling, You sent this message to the administrator. Please send it to the forum at [log in to unmask] so that everyone can benefit. Thank you for you participation in our TechNet forum. Leila Hady IPC 847/509-9700 x311 [log in to unmask] ---------- Forwarded message ---------- Date: Thu, 4 Jan 96 18:22 CST From: Wally Doeling (wallyd) <[log in to unmask]> To: TechNet-request <[log in to unmask]> Cc: "Wally Doeling (wallyd)" <[log in to unmask]> Subject: RE: Solder defect rate at 20mil pitch A little info is as follows... 4 years experience with 20 mil parts and 2 assembly houses Currently we have the following defect rates calculated by solder joint quantity. Each pitch is calculated against the total number of solder joints produced by pitch. (DPM) 50 mil pitch Supplier A. 3 PPM Supplier B 0.1 PPM 20 mil pitch Supplier A 7 PPM Supplier B 0.4 PPM Wallace Doeling Sequent Computer Systems [log in to unmask] ---------- From: TechNet-request To: TechNet Subject: Solder defect rate at 20mil pitch Date: Wednesday, January 03, 1996 5:55PM Here at Compumotor, we are going to be putting our first PCA with a 20 mil pitch QFP into production in the near future. I'd like to do some benchmarking of what everyone has seen as the difference in soldering defect rates between 50mil pitch and 20mil pitch SMT components. (Defects here being defined as a short between pins or an open between pin and pad.) Historical data on dpm at the solder joint level would be great, but I realize probably not realistic to ask for. The difference in first time test yield of comparable boards with with and without fine pitch parts would also be very valuable. Thank you in advance. Bryan Woods Manufacturing Engineer Parker Compumotor Phone: (707)584-2542 FAX: (707)584-8015 Email: [log in to unmask]