Hello all, We are evaluating the assembly process for a 432 ball Super BGA (Ball Grid Array). Is there anyone who can share assembly experience with this package family. I am interested if anyone done measurements on how much the package collapse during reflow, problems with package "tilting"? Hans Bogren Ericsson Telecom AB E-mail; [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************