Hello all,

We are evaluating the assembly process for a 432 ball Super BGA (Ball Grid Array). 
Is there anyone who can share assembly experience with this package family. I am interested if 
anyone done measurements on how much the package collapse during reflow, problems with package 
"tilting"? 

Hans Bogren 
Ericsson Telecom AB
E-mail; [log in to unmask]

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