Date : 24/10/96 12:51 Msg From: S MAITRA Dear Technetters, We are looking for following clarifications and would appreciate if someone can reply on this: 1) Under section soldering clause no. 4.2.1 (exposed basis metal) of IPC-A-610B clarify the non conforming defect for class 1,2,3 a) Is copper exposed to be treated as a defect if on EMI pad? b) Is copper exposed to be treated as a defect if on Mounting hole (explain for top and bottom side both)? c) Is copper exposed also to be treated as a defect if any where on the board except traces? 2) Under section IPC-A-600D section 11.6 Solder Mask Cracking and Scratches for acceptable condition class 1,2 & 3. Please clarify conductive pattern in reference to exposed copper. In other words as per our understandings IPC-A-610B does not allow any copper exposed on assembled boards on either of the sides. Does this neccesarily mean that under IPC-A-600D also no copper exposed is allowed on either side of the board ? Is a pin point Copper exposed also a reject on assembled board and under what magnification and lumminance should this be inspected? We will really appreciate your quick response on this. S. MAITRA Deputy General Manager - QA ALtos India Ltd. Fax :91-124-340842/91-124-340892/91-11-6488591 Phone :91-124-340867/340868/340872 E-Mail:[log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************