Steve, There would only be one potential benefit and that would depend on the application of your assembly. Ag additions at the 2wt% level do give improved creep performance. This could be important if your PCB is mounted vertically with heavy, and hot devices. All the data I've seen so far indicates that Sn62 has no better fatigue performance than Sn63. The original intent of 2% Ag additions to solders was to minimize the dissolution of Ag terminations of chip caps and resistors into the solder joint by reducing the Ag concentration gradient and thus slowing down the Ag diffusion rate. Now that most chip device manufactures offer Ni barriers in their termination metallurgy, Sn62 seems redundant. Don Foster [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************