Typically BURNT copper would NOT be acceptable due to the fact that tensile strength, elongation, and ductility will be severly comprimised. Regards, Alan B. Cochrane Multek Inc. ______________________________ Reply Separator _________________________________ Subject: FAB, ASSY: "Copper Burning" during plating Author: [log in to unmask] at INTERNET_GATEWAY Date: 10/21/96 10:54 AM This morning, I was looking at some boards that had pads covered with copper bumps, blisters, pimples, or whatever you want to call them. I've been told this was a product of copper "burning", resulting when boards are plated with current too high. Is this burnt copper unacceptable? I didn't see any pictures in IPC-A-600 to suggest it wasn't, but don't like the looks of the plating. Any comments? Thoughts from assemblers would be welcome, too. Lou Hart Compunetics Quality Assurance 412-858-6117 . *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************