This is a similar question to the loose hardware after wave solder issue. If a stainless steel pressed-in pem nut were to undergo a forced convection reflow cycle, would the pushout / torque-out force be any less than if it were installed after reflow? The board material is FR-4. The hole is unplated and is properly sized for the pem nut. Thanks in advance. Peter Wong *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************