This is a similar question to the loose hardware after wave 
solder issue.

If a stainless steel pressed-in pem nut were to undergo a forced
convection reflow cycle, would the pushout / torque-out force be any
less than if it were installed after reflow?  The board material is 
FR-4.  The hole is unplated and is properly sized for the pem nut.

Thanks in advance.

Peter Wong

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