I would think the only thing left would be to simulate the customers wire bond process yourself, to be sure you meet their pull strength parameters. Need to know wire diameter and attachment method (wedge or ball) then find someone who can do the bonds and pulls for you. This works as a good process indicator for the gold plating process you're using and can give an indication of contaminants too. ______________________________ Reply Separator _________________________________ Subject: Wire Bonding Author: [log in to unmask] at INTERNET_GATEWAY Date: 10/15/96 4:12 PM Advice please ! Is there a quantitative test that can be carried out on soft gold electroplate to qualify its suitability for wire bonding ? Gold thickness and purity already to customers spec. Note in this instance gold is on a nickel undercoat. Jim Douglas Kam Circuits *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************