FROM: I. MEMIS, DEPT GGMG/BLDG 257-4, AISLE A, ENDICOTT ENDICOTT ELECTRONIC PACKAGING SUBJECT: Alloy 42 TSOP Solder Joint Cracks Assuming that non-cracked joints are made in the assembly process, the fatigue life of these joints is limited. We have successfully used a backfill approach to resolve that problem. If anyone wants details, please contact me. Irving Memis 607-755-6022 IBM Endicott [log in to unmask] Irv Memis USERID: MEMISIRV, NODEID: ENDVM5, TEL: 855-6022 FAX: 857-1126 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************