Is there any research on finished via structure and the integrety of the connection; specifically tented or plugged vias vs. non-tented vias (lpi solder mask) filled with solder. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************