Hi, I had a simalar problem with Jleaded devices recheck your profile. you may have a problem with heat planes under some of these pads that are giving you a greater than 20Degree delta betweeen the PWA and the Componenet. Hector Valladares 813-539-3683 _______________________________________________________________________________ From: [log in to unmask] on Thu, Oct 3, 1996 7:11 PM Subject: BGA defects To: [log in to unmask] We are experiencing a problem with SMT assembly of CBGA modules onto Entek boards. On about 1% of the boards (a significant number at our volumes), solder from one or more of the pads does not wet the pad during reflow but wicks up onto the ball, creating an open. The defects appear to be randomly located and are only noticeable when we use no-clean solder paste. Previous studies have indicated that our oven profile is not the problem. Does anyone have experience with this kind of problem? Any ideas would be greatly appreciated. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** ------------------ RFC822 Header Follows ------------------ Received: by smtp2.space.honeywell.com with SMTP;3 Oct 1996 19:09:58 -0400 Received: from IPC.ORG by fl51mail.space.honeywell.com with SMTP (1.38.193.5/16.2) id AA19490; Wed, 2 Oct 1996 19:18:50 -0400 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id RAA24900; Wed, 2 Oct 1996 17:53:48 -0700 Resent-Date: Wed, 2 Oct 1996 17:53:48 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0v8ZP3-0000SzC; Wed, 2 Oct 96 17:04 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> From: [log in to unmask] Message-Id: <[log in to unmask]> Date: Wed, 2 Oct 96 17:44:50 EDT To: [log in to unmask] Subject: BGA defects Resent-Message-Id: <"Im-OF1.0.068.gRkKo"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/6644 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************