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Date: Mon, 7 Oct 96 15:59:36 EDT
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Does anyone have experience with Surface Mount Soldering plastic TSOP
packages?

We are experiencing cracks in these SMT TSOP solder joints.  The cracks
start in the heel and propagate to the toe of the solder joint.  
Initialy these cracks were observed after the convection solder 
operation.  We then reduced the amount of solder (6.5 mil height) 
and the temperature of the solder operation (205-210 C).  Although
the solder joints looked good after the SMT process they did crack 
after the subsequent wave solder process.

The leads of the TSOP device are Alloy 42 (Kovar) fine 19.7 mil pitch.
The PWB material is Multifunctional Glass (Tg 180).

Edward Karnish
Lockheed Martin Communication Systems
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phone 609-338-3182   
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