The problem can be resolved by reducing the belt speed dramatically, if using N2 atmosphere. The flux may not be breaking down the coating before becoming liquidous. The flux may also need to be changed as there are some pastes that are not compatible with Entek! [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: BGA defects Author: [log in to unmask] at ftl03 Date: 10/2/96 7:12 PM We are experiencing a problem with SMT assembly of CBGA modules onto Entek boards. On about 1% of the boards (a significant number at our volumes), solder from one or more of the pads does not wet the pad during reflow but wicks up onto the ball, creating an open. The defects appear to be randomly located and are only noticeable when we use no-clean solder paste. Previous studies have indicated that our oven profile is not the problem. Does anyone have experience with this kind of problem? Any ideas would be greatly appreciated. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************