We are experiencing a problem with SMT assembly of CBGA modules onto Entek boards. On about 1% of the boards (a significant number at our volumes), solder from one or more of the pads does not wet the pad during reflow but wicks up onto the ball, creating an open. The defects appear to be randomly located and are only noticeable when we use no-clean solder paste. Previous studies have indicated that our oven profile is not the problem. Does anyone have experience with this kind of problem? Any ideas would be greatly appreciated. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************