Joseph Haimovich Sent you E-mail on 9/15 on T Sonada as to some of his work on tin plating and whiskers. See by your 10/02 E-mail that you did not receive it. Tried to resend it to you, but yesterday I upgraded from AOL 2.5 to AOL 3.0 and received an error signal that the file is no longer available. At any rate here it is again, I will send it to you and to technet so you will have two chances". T. Sonada, Plating and Surface Finishing, 79, No 10 (1992) T. Sonada, Plating and Surface Finishing, 82, No 3 (1995) T. Sonada, Metal Finsihing of Japan, 40, 306 (1989) At the SMI conference in Sept 1996, Dr. Y. Zhang of Lucent Technologies gave an interesting paper in which she studied some of the relationships of plating deposits and tin whiskers in a Paper entitled "An Alternate Surface Finish for Tin/Lead Solders". She also referenced a paper that you gave at an Electronic Component Conference in 1989. Her paper had some other good references back as far as some of Arnold's papers on whiskers. The papers are published in the SMI Proceedings. If you do not have a copy of the paper let me know and I will run you a copy. Phil Hinton Hinton PWB Engineering [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************