I would appreciate any comments anyone has on PLCC device low profile socket reliability. Vibration and Shock levels specified for our equipment are typically: Shock: (30g 11ms Half Sine pulse) Vibration: 13-100 Hz @ 1.0 G Ten sweeps at one octave per minute The vibration spec for the socket is 10 G 10-500 Hz. Arguments rage internally over the reliability of the connection. We have only employed the sockets temporarily early in the product life cycle to accommodate software updates, and then directly soldered the parts when changes settle down. We currently use a type with an open bottom which helps with soldering and cleaning. We haven't had any field complaints yet and don't have any real complaints from manufacturing except that the masking is a pain for conformal coat. Life testing really isn't feasible at this point. Are these sort of sockets commonly used? Thanks Randy Johnson Reliability Engineer Woodward Governor Company Loveland, Colorado [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************