Dear TechNet, We are looking into setting up a PCMCIA assembly line. We will probably produce low to medium volumes. What kind of depanelizing process would work best? We currently use a perforated tab method on regular boards. Will this method be acceptable for the thin PCMCIA boards? Thanks for your help. Jeff Baldwin [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************