bare copper panels are never subjected to HASL or HASL fluxes, which leave residues that do not show up on an omega meter. This means that bare copper panels coated with an Organic Protective Coat arrive with higher SIR. HASL panels are also more variable in metal amount, finish and solderability. I never do SIR testing on solder plated panels. The incoming SIR can sometimes be lower at the start than the end of my process due to supplier inconsistancies. I.E. the supplier may give me a panel that starts with more contamination than I put on during my process. ______________________________ Reply Separator _________________________________ Subject: Flux complinace to J-Std-001A Author: [log in to unmask] at internet Date: 9/27/96 10:44 AM We are in the process of trying to comply with the provisions of J-Std-001A, Appendix D-4.1, which basically states that level 2 testing (SIR test, Ionic Contamination, and visual inspection) needs to be done to qualify your process for the use of water soluble fluxes. I have the IPC-B-36 Circuit boards and the 68 Pin LLC's needed to run the test. I was quite surprised to see that my IPC-B-36 boards have copper lands and traces on the boards. There is a document called IPC-TP-1044 which outlines an oven bake process followed by a microetch process using Enplate PC-499, cascading water rinses, and other materials (18 steps in all !). This microetch process is followed by Omegameter 600SMD process and then followed by board drying in a nitrogen autoclave. The boards were then placed in Kapak bags which were "tested" to be non-contaminating. I have the following questions: - Why do the boards have copper traces ? Why aren't they tin-lead ready for soldering ? - Is there a simpler way to get these boards clean in preparation for soldering ? Thanks, Bill Kasprzak, Moog Inc., 716-652-2000 ext 2507 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************