We are in the process of trying to comply with the provisions of J-Std-001A, Appendix D-4.1, which basically states that level 2 testing (SIR test, Ionic Contamination, and visual inspection) needs to be done to qualify your process for the use of water soluble fluxes. I have the IPC-B-36 Circuit boards and the 68 Pin LLC's needed to run the test. I was quite surprised to see that my IPC-B-36 boards have copper lands and traces on the boards. There is a document called IPC-TP-1044 which outlines an oven bake process followed by a microetch process using Enplate PC-499, cascading water rinses, and other materials (18 steps in all !). This microetch process is followed by Omegameter 600SMD process and then followed by board drying in a nitrogen autoclave. The boards were then placed in Kapak bags which were "tested" to be non-contaminating. I have the following questions: - Why do the boards have copper traces ? Why aren't they tin-lead ready for soldering ? - Is there a simpler way to get these boards clean in preparation for soldering ? Thanks, Bill Kasprzak, Moog Inc., 716-652-2000 ext 2507 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************