Does anyone have any information on the above topic?  I am interested in 
knowing what the Relative Humdity should be in an area of pcb storage to 
minimize outgassing problems for wavesolder.  IPC Ansi J Stnd.  says 70% RH 
or less but, should not be below 30% due to ESD concerns.  Is there a 
defined "Sweet Spot" for RH levels to reduce outgassing problems?  How long 
does it take for a pcb to "soak up" moisture?  Any information/comments 
appreciated.

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