Does anyone have any information on the above topic? I am interested in knowing what the Relative Humdity should be in an area of pcb storage to minimize outgassing problems for wavesolder. IPC Ansi J Stnd. says 70% RH or less but, should not be below 30% due to ESD concerns. Is there a defined "Sweet Spot" for RH levels to reduce outgassing problems? How long does it take for a pcb to "soak up" moisture? Any information/comments appreciated. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************