Does anybody know what is the tin-lead HASL plating thickness requirements 
for printed circuit boards?   Do you have any standards which specified it? 
 IPC-A-600D specified only the minimum plating thickness,  which is 0.005mm 
or 0.0002" for our application.
We are having a problem with  the circuit board which plating thickens is 
greater than the other ones.   Also,  the plating surface is not  flat.  
This is not the fine pitch components board.  But,  when pads are so 
"bumpy" and plating is thicker than other boards,  the adhesive dots 
application  becomes difficult.   Glue dispenser shall be adjusted for the 
proper adhesive dots size.
It would be greatly appreciated if anyone could give me any directions.


 

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