Does anybody know what is the tin-lead HASL plating thickness requirements for printed circuit boards? Do you have any standards which specified it? IPC-A-600D specified only the minimum plating thickness, which is 0.005mm or 0.0002" for our application. We are having a problem with the circuit board which plating thickens is greater than the other ones. Also, the plating surface is not flat. This is not the fine pitch components board. But, when pads are so "bumpy" and plating is thicker than other boards, the adhesive dots application becomes difficult. Glue dispenser shall be adjusted for the proper adhesive dots size. It would be greatly appreciated if anyone could give me any directions. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************