Hello Steve Holen,

The bad solder joint reliability with TSOP and Alloy 42 leadframes is indeed 
an issue. It also seems difficult to have an influence on the vendors to 
change lead frame material to copper. We have to use what we get!?

Have you looked at other solutions to improve solder joint reliability 
(with Alloy 42 leadframes) but still using the standard FR4 material/build 
ups? (tough solder, epoxi dispensing of the leads, underfill, pkg 
encapsulation).

Hans Bogren
PBA technologies
Ericsson Telecom AB
Sweden

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