For Wave soldering you can refer to your Flux Profiling and Data sheet for Temperature ranges. ______________________________ Reply Separator _________________________________ Subject: Thermal Profile for HASL Author: [log in to unmask] at ~INTERNET Date: 2/14/96 8:36 AM Received: by ccmail Received: from netcomsv by pragma.com (UUPC/extended 1.11) with UUCP; Wed, 14 Feb 1996 08:28:38 PST Received: from simon.ipc.org by netcomsv.netcom.com with ESMTP (8.6.12/SMI-4.1) id QAA00664; Tue, 13 Feb 1996 16:35:51 -0800 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id QAA04581; Tue, 13 Feb 1996 16:03:21 -0800 Resent-Date: Tue, 13 Feb 1996 16:03:21 -0800 Received: by ipc.org (Smail3.1.28.1 #2) id m0tmTbA-00005ZC; Tue, 13 Feb 96 16:53 CST Old-Return-Path: <[log in to unmask]> From: "Turbini, Laura" <[log in to unmask]> X-ccAdmin: postmaster@netcomsv To: TechNet <[log in to unmask]> Subject: Thermal Profile for HASL Date: Tue, 13 Feb 96 17:19:00 EST Message-ID: <[log in to unmask]> Encoding: 15 TEXT X-Mailer: Microsoft Mail V3.0 Resent-Message-ID: <"v15I5.0.yD7.ZPH8n"@ipc> Resent-From: [log in to unmask] X-ccAdmin: postmaster@netcomsv X-Mailing-List: <[log in to unmask]> archive/latest/2667 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] We are planning to process some boards in an table top convection reflow oven and for one of our studies, we wish to use a HASL fluid. Can someone suggest an appropriate thermal profile to reflect the HASL process. Also, is there a preferred thermal profile for wave soldering with water soluble flux? Thanks, in advance, for your input. Laura J. Turbini Professor, Materials Science and Engineering Georgia Institute of Technology [log in to unmask]