Take a look at: "IPC-GH-850: Handbook of Interconnection Contact Finishes" "Connector Reliability i The Military Environment", Stuart Koford, Connection Technology, May 1989, pp. 19-22". Both references have some good information on gold-copper interactions. Also keep in mind that there is a difference between a gold - copper galvanic reaction and a gold - copper diffusion reaction. Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: copper gold galvanic during OSP application Author: [log in to unmask] at ccmgw1 Date: 9/18/96 6:44 PM Does anybody have any information or experience with the above issue? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************