We currently process core boards with vias in the surface mount pads. Parts are soldered directly over the filled vias with plating and solder over the vias. Roxanne Tovey ______________________________ Reply Separator _________________________________ Subject: Re: via holes & surface mount components Author: [log in to unmask] at esdigate Date: 2/13/96 10:39 AM Via hole should be atleast .025 away from surface mount pads. ______________________________ Reply Separator _________________________________ Subject: via holes & surface mount components Author: [log in to unmask] at corp Date: 2/12/96 4:10 PM What is the minimum distance via holes can be to surface mount components?