Technetters In the mid 1970's Paul Davis of Tin Research wrote an article on dewetting as result of pumice scrub. Does anyone have a reference to where this was published. Also does anyone have any input as to dewetting as result of pumice scrub in relation to a sequence of: (1) pumice scrub, (2)apply solder mask, (3) hot air level, (4)solderability test and dewet.. Another question on dewetting. Has anybody seen dewetting as a result of a white residue on the lands and board which was analyzed as lead carbonate? And another:where does the lead carbonate come ? Phil Hinton Hinton PWB Engineering [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************