Hi! The authors are F.G. Yost, F.M. Hosking, D.R. Frear, published by Van Nostrand Reinhold, Library of Congress Card Number 93-23151. I would suggest you give your library or Info search folks the ISBN number - they seem to have much better luck with that rather than the other info I just listed. Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Re[2]: PCB board age Author: [log in to unmask] at ccmgw1 Date: 9/17/96 3:30 PM Dave- Could you provide the author name and/or publisher for "The Mechanics of Solder Alloy Wetting and Spreading", ISBN 0-442-01752-9? Thanks Michael S. Alderete email: [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Re: PCB board age Author: [log in to unmask] at _internetcc Date: 9/17/96 11:11 AM Good Morning Tom- I don't know of any specification requirements that would restrict you from using a reflowed pwb but why were the pwbs reflowed after 9 months of storage? Any reflow operation will increase the amount of copper/tin intermetallic you have on the pwb. If the fusible solder layer isn't thick enough then you will have the copper/tin intermetallic "grow" to the surface and become oxidized. At that point you can either use a stick of dynamite or an acid flux to make things solderable again! Take a look at figure 6-2, page 162 of "The Mechanics of Solder Alloy Wetting and Spreading", ISBN 0-442-01752-9, for a nice depiction of how the amount of fusible solder available can impact your solderability. I have seen people "reflow" poor solderable pwbs in the past as a method of restoring the solderability but this is only effective if the source of the solderability degradation was heavy surface oxidation. If the source was intermetallic oxidation then the reflowing only makes the pwb worst. This is also the reason many assemblies process HASL fabricated pwbs in short times (6-8 months) - the HASL process tends to leave a thinner solder coating than other fusing processes and can be more susceptible to intermetallic oxidation. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: PCB board age Author: [log in to unmask] at ccmgw1 Date: 9/16/96 4:43 PM We stuff and solder (both wave and hand) small runs of PCBs (primarily PTH components. Our boare board requirements include individual packaging and boards no older than 6 months. A supplier recently shipped us boards that were re-reflowed 9 months after their original fabrication. Is this acceptable within A-610 for hi-rel commercial applications? Thanks. Tom Moore Electro Plasma Tom Moore *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************