Try having the FAB house repress PCBS using a controlled (slower) cool down. This will commonly flatten even the worst warp for pre heat operations ( stenciling and pick-and-place). Reflow or wave will most likely cause the warp to return so be careful with post operation cool down ( the warp reappears during ramp-up of temp for adhesion process, so do not try to unwarp assembled PWB). *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************