Check IPC-R-700C, "Suggested Guidelines for Modification, Rework & Repair of Printed Boards & Assys.," 4.1.2.1. Greg Kilinski Acuson [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Unidentified subject! Author: [log in to unmask] at ccUnix Date: 9/13/96 09:10 AM We are looking for help to save some 4 layer boards that have a slight but unacceptable warp. The warp occured when the books were taken apart too soon after lamination. We looked at the construction and the layout and ruled them out as to contributing to the problem. They did not have a proper cool down cycle. Does anyone know of a way to get rid of the warpage? These parts are 12" x 9" x .062" Thanks again, Jim Moritz *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************