Dear Designers, Our company is a Contract/Turnkey manufacturer, who is engage in PWB assembly as well as Box Build assembly. We are currently on a study and want to try our Chip on Flex capability. May I solicit some information about: 1. Flex design (for COF application) - Type of mat'l - Recommendations on adhesive (type) - Pad architechture 2. Critical Parameters (Bonding and Curing process) 3. Indirect mat'ls rcommendations - Die attach epoxy - Glob top mat'l Thank you. -- Engineering Department Electronic Assemblies, Inc. - http://www.globe.com.ph/~eai *************************************************************************** * The mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text.* *************************************************************************** * If you are having a problem with the DesignerCouncil, please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************