Dear Designers,

Our company is a Contract/Turnkey manufacturer, who is engage 
in PWB assembly as well as Box Build assembly. We are currently
on a study and want to try our Chip on Flex capability. May I
solicit some information about: 
   1. Flex design (for COF application)
                - Type of mat'l
                - Recommendations on adhesive (type)
                - Pad architechture
   2. Critical Parameters (Bonding and Curing process)
   3. Indirect mat'ls rcommendations
                - Die attach epoxy
                - Glob top mat'l

Thank you.
--
Engineering Department
Electronic Assemblies, Inc. - http://www.globe.com.ph/~eai

***************************************************************************
*   The mail list is provided as a service by IPC using SmartList v3.05   *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.*
***************************************************************************
* If you are having a problem with the DesignerCouncil, please contact    *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************