Fellow Designers; The IPC Designers Council Education committee has completed the objectives for the High Speed Design Focus Module. These objectives will be used to create a study guide, and eventually the questions for the examination. We wish to share these objectives with you, and solicit your comments. Comments should be constructive, and include recommendations for improvement, inclusion, or exclusion. The objectives will cover the ten major subject areas: Layout Electrical considerations Material properties Component requirements Assembly technology Board fabrication Physical board requirements Documentation Inspection test Reliability In addition, we ask for any technical inputs for inclusion in the study guide. You may believe that there are critical issues that need to be covered, and this information is extremely valuable to us. We will accept any input from a finished paragraph to an outline of critical issues. Comments should be sent to Hugo Scaramuzza at [log in to unmask] Layout 1H.1 Planning and Layout Strategy 1H.2 Circuit Analysis 1H.3 Component Placement 1H.4 Conductor Routing/Critical Length 1H.5 Decoupling Networks 1H.6 Impedance Modeling &Control 1H.7 Termination Implementation 1H.8 Loading Issues 1H.9 Crosstalk & EMI Control 1H.10 Power Distribution Implementation Electrical considerations 2H.1 Basic Electronic Theory 2H.2 High Speed Definition 2H.3 High Speed Concerns and Issues 2H.4 Effective Operating Frequency 2H.5 Signal and Wave Propagation 2H.6 Signal Attenuation 2H.7 Crosstalk and EMI Theory 2H.8 Impedance Control and Reflection 2H.9 Power Distribution Theory 2H.10 Capacitive/Transmission Lines 2H.11 Termination Characteristics Material properties 3H.1 Materials and Relative Permittivity 3H.2 Physical Material Properties 3H.3 Material Selection Trade-offs 3H.4 Hi-Frequency vs CTE materialsGlass 3H.5 Transition Temp. Impact Component requirements 4H.1 I/C Logic Families and Edge Rate 4H.2 Connector Systems 4H.3 Resistive Elements and Components 4H.4 Component Selection Issues Assembly technology 5H.1 Component Attachment Implications 5H.2 Conformal Coating Characteristics Board fab 6H.1 Production Core vs Prepreg 6H.2 Power and Ground Plane Alignment 6H.3 Lamination Techniques & Effects 6H.4 Copper Thickness/Surface Control Board physical requirements 7H.1 Microstrip Transmission Line Board 7H.2 Embedded Microstrip Trans. Line 7H.3 Single Stripline Transmission Line 7H.4 Dual Stripline Transmission Lines 7H.5 Board Structure Analysis Documentation 8H.1 Impedance/Equation Analysis 8H.2 Conductor Width/Spacing Analysis 8H.3 Printed Board Structures 8H.4 Layer Definition and Tolerancing Inspection/test 9H.1 Coupon Design and TDR Testing 9H.2 Microsection Analysis 9H.3 Design for Test Principles Reliability 10H.1 Performance Characterization 10H.2 Thermal Management and effects *************************************************************************** * The mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text.* *************************************************************************** * If you are having a problem with the DesignerCouncil, please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************