I would like to know the pros and cons of putting vias under capacitors and resistors. I was wondering what other designers were doing. I have some designs coming up that I may need to put vias where ever I can. I have soldermask under my components, but not on the via pads. I would maintain a .014 pad/pad clearance (.005 soldermask web). The via signal would not necessarily be the same as the component pad signal. Any information and wisdom will be greatly appreciated. Thanks in advance! Brandon Luther Dataram Corp. [log in to unmask] (609) 799-0071 x310 *************************************************************************** * The mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text.* *************************************************************************** * If you are having a problem with the DesignerCouncil, please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************