Hello Designers: Is anyone familiar with having PCB outlines punch-cut out of the panel? I'm interested in knowing if there are specs (additional tol needed around board edge etc.) and quality concerns based on using hi-temp, gold bondable FR4 mat'l that's .024" thick. The attachment process would be wire-bonding to bare die on board, if that raises any further concerns. Thanks for your feedback. **************************************************************************** * The mail list is provided as a service by IPC using SmartList v3.05 * **************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ****************************************************************************