> Ray Turner wrote: > We have been wave soldering SOIC and SOJ packages for quite some > time, but recently we are finding solder balls flattened like pancakes > underneath these devices after wave solder. The package stand-offs are > the standard 8-10 mils for the SOICs and 25-26 mils for the SOJs and > we have not been able to identify any process or material changes that > may be causing this phenomenon. We have designed several PCB's that utilize the wave soldering process to solder large active devices on the board. We were first made aware of this phenomenon as we tested the PCB's and detected a short between two signals. Upon further observation we discovered that solder had found its way under the device and shorted two vias that were also under the device. We were able to determine that this phenomenon only occurredon the leading edge of the board as it goes through the wave. We were able to make several adjustments and the phenomenon disappeared. \_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_ \_ \_ \_ Todd J. Zorn Email: [log in to unmask] \_ \_ Technical Analyst - PCB Design \_ \_ The Allen-Bradley Company \_ \_ 1201 South Second Street \_ \_ Dept. J8751, Control Logic Phone: (414) 382-3971 \_ \_ Milwaukee, Wi. USA 53204 FAX: (414) 382-3737 \_ \_ \_ \_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_