Hello, I would like to do some accelerated aging tests for solderability of eutectic solder. The solder is over nickel over copper on board material (FR-4). Does any one know any respectable tests in the literature that claim to approximate 6 months and 1 year of solder aging. If such a claim is not explicitly stated how are the results of such tests viewed. Does the I.P.C. recommend a particular test. How about the military? I have a programmable temperature and humidity chamber at my disposal , but would like information on all tests. Thanks Rich ------------------------------------------------------------------ Richard Olsen Telephone (602)-268-3461 Continental Circuits Corp. Fax (602)-268-0208 3502 East Roeser Road Pager (602)-310-6245 Phoenix Arizona Internet [log in to unmask] 85040-2905 USA I make circuit boards,what do you do? ------------------------------------------------------------------