Hello, I am working on a design that is using BGA's and I would like to model the vibration reliability. One reference I found to vibration is "Designing Electronics for High Vibration and Shock" by Howard W. Markstein from the April 1987 issue of Electronic Packaging and Production. In this article I believe Mr. Markstein references Dave S. Steinberg's work that defines a component parameter "c". There are values for DIPs, LeadlessCCs and various PGAs in the range of 1.0 for DIP to 2.25 for LeadlessCC. Has anyone developed any reliability testing for BGA's? Thank You in advance? Kevin Thorson Unisys Corporation (612) 456-2639 [log in to unmask]