Via-in-Pad for BGA Has anyone had experience with via-in-pad for BGA devices? As I see it, there are some advantages and disadvantages of the concept: Advantages: 1) Secondary-side test access for ALL nodes of the BGA, possibly eliminating the need for an expensive clam-shell ICT test fixture. 2) Less stressful BGA removal, since bottom-side heat will help liquify the ball/solder interface EQUALLY over the entire IC without the need of extensive component package heating. 3) Trace routing for inside nodes can use any of several inner layers, thus making line density (width and space) more manageable and NOT eat up top-side PCB real estate. Disadvantages: 1) The via pattern does eat up inner layer and bottom-side PCB real estate. 2) It does punch a lot of holes in the ground/power planes, making shielding in the BGA area more difficult. Are there any other items to be considered before embarking on this bold concept? Does IPC cover this type of assembly with an industry "standard"? Bill Fabry Truevision, Inc. [log in to unmask]