INTERNATIONAL CONFERENCE ON ELECTRONIC ASSEMBLY: Materials and Process Challenges Including BGA, Flip Chip And Other High Density Technologies May 29, 30, 31, 1996 Co-Sponsored by Georgia Institute of Technology School of Materials Science and Engineering Atlanta, Georgia and Institute for Interconnecting and Packaging Electronic Circuits Call for Abstracts The International Conference on Electronic Assemby: Materials and Process Challenges (including BGA, Flip Chip and Other High Density Technologies) will be held at Georgia Institute of Technology on May 29-31, 1996. Co-sponsored by the IPC, this international conference is an outgrowth and expansion of the International Conference on Soldering Flux and Pastes held every two years at Georgia Tech. Technology advances are moving beyond fine pitch placement and soldering, toward ball grid array (BGA) and direct chip attach (DCA). This requires that new materials and processes be developed to interface with and in some case replace traditional assembly technology. Suppliers of soldering fluxes and pastes are developing materials for solder bump, conductive polymer and polymer underfill in response to demands of designers and process engineers who need these for their new high density product development. These challenges coupled with the drive toward environmentally conscious approach toward electronics manufacturing make these exciting times. Call for Abstracts Abstracts are requested in the following areas: Soldering in the Post-CFC Era Fine-pitch and Ultra-fine Pitch Assembly Assembly Processes for BGA and Direct Chip Attach New Materials for BGA and Direct Chip Attach Test Methods for Materials Reliability Including Surface Insulation Resistance, Electrochemical Migration, Corrosion Measurements, etc. Environmentally Friendly Materials and Processes Including Lead-free Solder Alloys, Conductive Polymers, etc. PROGRAM COMMITTEE Prof. Laura J. Turbini Alvin F. Schneider Georgia Institute of Technology Alpha Metals Chairman David Bergman Tom Fujikawa IPC Malcolm Instruments Kathi Johnson Dr. Wallace Rubin Hexacon Electric International Consultant CONFERENCE SPONSORS IPC School of Materials Science and Engineering Georgia Institute of Technology ABSTRACTS DUE: February 1, 1996 ABSTRACTS ACCEPTANCE: March 1, 1996 FULL PAPERS DUE: April 19, 1996 SUBMIT ABSTRACTS TO: International Conference on Electronic Assembly Professor Laura J. Turbini Materials Science and Engineering 778 Atlantic Drive Atlanta, Georgia 30332-0245 (404)894-9140 FAX [log in to unmask] ABSTRACT INFORMATION Title Author(s) 200 - 300 word abstract Principal Author: Name Title Company Address City State/Province Postal Code Telephone FAX e-mail