June Dinner Meeting, IEPS Los Angles/Orange Chapter, 7 June 95 The Orange County Chapter of The International Electronics Packaging Society Presents: Plastic IC Packaging Wednesday, 7 June 1995 Holliday Inn Maingate 5:00 p.m. - 8:30 p.m. Harbor Blvd, So of Katella Anaheim, Ca USA 714-750-2801 Cost: IEPS Members: $12, Nonmembers: $15 The technical program runs from 7:30 P.M. to 8:30 P.M., Plastic IC Packaging Len Enlow o Military/High-rel Applications o Information Gained from Literature o Cost o Failure Modes/Failure Accelerators o Advantages of Plastic Packaging o Disadvantages of Plastic Packaging Len Enlow, Materials & Process Lab, Rockwell, is currently following and reporting on this topic as a part of his duties at Rockwell Electronis Systems Division, Anaheim. Mr. Enlow is responsible for materials and process development and support for all company electronic programs. He has over 28 years of electrical design, engineering, and production experience in microelectronic circuits and packaging. Mr. Enlow has designed circuit modules for a broad range of military, space, medical and comercial applications been responsible. He has been responsible for design, layout, simulation, testing and documentation of thin and thich-film hybrids, low-temp. cofired ceramic substrates and multichip modules. Voice RSVP to: Bob Hausmann IEPS OC/LA Chapter Phone: (714) 779-8086 E-mail RSVP may be directed to [log in to unmask] (Bill Gaines, OC-LA IEPS chapter board member) Please direct e-mail questions about the IEPS OC/LA Chapter to: Bill Gaines, <[log in to unmask]> m-th ===================================================================== Information about the IEPS may be obtained via e-mail at [log in to unmask] =====================================================================