To All:

  Recently when building a 1210 footprint for our CAD design software per
IPC-SM-782 (subsection 8.2), we noticed that the recommended land dimensions
for 1210 chip capacitors are smaller than the actual width of the component
and terminal area of part. We also noticed that it is the same for case sizes
1812 and 1825 but not for case sizes lower than 1210.

 Secondly, We are also curious about the melf package SOD-87/MLL41 footprint
(subsection 8.5). The recommended footprint is huge compared to the actual
melf component.

  If anyone can tell me if these recommended footprint dimensions are
correct/incorrect and why they are as such please respond.

  thanks,

Kevin Berry
Geco-Prakla, Schlumberger
10420 Miller Rd.
Dallas, Tx. 75238
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