Hi Norm, Thanks much for the information. It is clear that flip chip and many chip scale packages will be requiring such feature sizes for their interconnection substrates. It would seem to me that it would be in the best interests of these folks to fill the airways with information about the nature of their stucture and its relaibility. It is clearly of no value either to them or to the industry locked in a cellar. We cannot be expected to but what we cannot see. Cheers, J. Fjelstad