A little more feedback would be: At 1.5.1.2 I would add....chemical properties of some clad innerlayer laminar bonds degrade with excessive baking of laminates. 1.5.2....Generally, full cure of the initial core laminate is done.... (And) .....shipment to printed board fabricators. Full cure of composite multilayer PCB is done by the fabricator based on the laminate vendor's recommendation for correct.... (Under Tg testing) ....If the second test differs significantly (Typically any findings >4'C indicate under cure),...... 1.5.3....various constituents of the laminate coupled with the material manufacturing process. (Under resin type) I don't see some of these Tg values correspond to the material (all) available. Maybe a range would be a more representable approach. ie, Multifunctional Epoxy 140 - 150'C, High Temp Multifunctional Epoxy 160 - 180'C, etc. Also the 220'C Polyimide probably should be pulled out separate as a Polyimide Blend at 220'C. The listed bake times are becoming more static because the laminate vendors are formulating higher Tg's with quicker cure times. As far as baking fully assembled PWAs, I always recommend 15 minutes per layer at 220 - 230'F. This assures that high layer count product receives ample time to drive off any absorbed moisture. Higher layer count also has contains more resin than fiberglass which traps, retains, and is harder to remove than a double sided product. Also, the temperature is high enough to remove moisture yet low enough to not destroy most components. Dave Hoover Senior Process Engineer/Hadco Corp. TCII [log in to unmask]