In the August issues of Elect. Pack & Prod. there is mention (pg 28) of a new surface solderability test method in development. The actual details of the test are not given but it sounds like an interesting approach: Essentially, the test involves screen printing 8 paste dots onto a solderable PWB test area. the dots have identical mass but their spacing varies from 450 to 150 microns. After reflow, perfect solderability would be indicated by an absence of any gaps and the number of "gaps" shown would score less than perfect cases. The test was apparently originally developed for Phillips Center for Technology and is currently being evaluated with submission to IEC estimated around 4th Qtr '95. My question is does anyone have any contact numbers for British Standards Institute (Len Pillenger) or John Burke of Forward Circuits (the two individuals named in the article as currently working on this test method.) I would assume both are located in Europe. thanks for the help. Jim Maguire Boeing Defense & Space Group [log in to unmask]