We have been wave soldering SOIC and SOJ packages for quite some time, but recently we are finding solder balls flattened like pancakes underneath these devices after wave solder. The package stand-offs are the standard 8-10 mils for the SOICs and 25-26 mils for the SOJs and we have not been able to identify any process or material changes that may be causing this phenomenon. Has anyone had a similar experience and found the cause for this defect? Any help would be much appreciated. Ray Turner Cabletron Systems