-- [ From: michael carano * EMC.Ver #2.10P ] --


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> Date: Monday, 18-Dec-95 10:21 PM
> 
> From: michael carano           \ PRODIGY:     (GNTB07A)
> To:   ipc                      \ Internet:    ([log in to unmask])
> 
> Subject: plated thru hole rim voids
> 
> There are a few reasons for the problem that you have described. One
> possibility is that there is too much pressure applied if the booards
are
> being scrubbed prior to dry film lamination. The other possibility is
that
> there was no catalyst in that area and thus no electroless copper
> iniation. 
> What type of electroless are you using? Or are you employing a direct
> metallization process? There are several different types of DM
processes
> on the market and it is a possibility that the problem is here.
> Also, what hole size is common for the rim void? When do you see the
rim
> void? After electroless? After electroplating? After etching?
> E-mail me back with some details of your process or call 1-800-321-
9050
> and ask for Mike Carano
> Good luck 

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