-- [ From: michael carano * EMC.Ver #2.10P ] -- ------- FORWARD, Original message follows ------- > Date: Monday, 18-Dec-95 10:21 PM > > From: michael carano \ PRODIGY: (GNTB07A) > To: ipc \ Internet: ([log in to unmask]) > > Subject: plated thru hole rim voids > > There are a few reasons for the problem that you have described. One > possibility is that there is too much pressure applied if the booards are > being scrubbed prior to dry film lamination. The other possibility is that > there was no catalyst in that area and thus no electroless copper > iniation. > What type of electroless are you using? Or are you employing a direct > metallization process? There are several different types of DM processes > on the market and it is a possibility that the problem is here. > Also, what hole size is common for the rim void? When do you see the rim > void? After electroless? After electroplating? After etching? > E-mail me back with some details of your process or call 1-800-321- 9050 > and ask for Mike Carano > Good luck ------- FORWARD, End of original message -------